Assessment of wetting of surface mount components Thermoire and Microcad installations
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Abstract
New method of wetting test for surface mount technology of electronic components was offered in this paper. Two optical systems for fixation of component height during the soldering – type TherMoire (Thermical Moire) and type MicroCAD (Computer Aided Design) were used for realization of experiments. The height change of component relatively to printed board and wetting time was estimated for analysis of solder wetting. As a result of performed experiments the types of pastes and the kinds of surfaces of printed circuit boards, for which investigated components have the best wetting, were estimated
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References
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