Electrothermal modeling of the thermal field of integral schemes when placing elements
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Abstract
A simulation method of a thermal field of a crystal of semiconductor integrated circuits (IC), based on the principle of electrothermal analogy, is proposed. The electric equivalent circuit of heat exchange of IC, constructed on current sources and resistances, is proposed. The commercial software simulation tool of electronic circuits SPICE is applied. The technique of application of the proposed simulation method at initial multiparameter placement of logic cells of IC is discussed. Efficiency of the proposed method is explained on a test example of a logic circuit. Integration of the proposed simulation method with placement tools of IC elements allows controlling the quality of placement of elements from the viewpoint of thermal mode of IC during the design process
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