Registration of mechanical stresses in the films on a solid state substrate by polarization-modulation technique
Main Article Content
Abstract
The article presents a modulation-polarization technique of stress-strain registration in film coatings of optically transparent solid substrates (both crystalline and amorphous). On the basis of the mechanical stress distribution in the surface layer of the solid substrate an approach is developed for calculation of physical parameters of deposited films. The resulting modified expressions of Stony equations that link plastic deformation of solid substrate with its optical parameters are obtained. Possibility of reverse deformations registration laid in calculations allowed to calculate the mechanical stresses in such a thin surface film that cause negligibly small plastic deformation of the substrate.
References 8, Fig. 4.
Article Details
![Creative Commons License](http://i.creativecommons.org/l/by/4.0/88x31.png)
This work is licensed under a Creative Commons Attribution 4.0 International License.
Authors who publish with this journal agree to the following terms:- Authors retain copyright and grant the journal right of first publication with the work simultaneously licensed under a Creative Commons Attribution License that allows others to share the work with an acknowledgement of the work's authorship and initial publication in this journal.
- Authors are able to enter into separate, additional contractual arrangements for the non-exclusive distribution of the journal's published version of the work (e.g., post it to an institutional repository or publish it in a book), with an acknowledgement of its initial publication in this journal.
- Authors are permitted and encouraged to post their work online (e.g., in institutional repositories or on their website) prior to and during the submission process, as it can lead to productive exchanges, as well as earlier and greater citation of published work (See The Effect of Open Access).
References
Stoney, G. S. (1990). Proc. Royal Soc. Ser. A. V. 82. NA553, pp. 172-175.
Timoshenko, S. P. (1925). J. Optical Soc. of America and Reviue of Scientific Instruments. Vol. 11, №
pp. 233-255.
Singer, P. (1992). Film Stress and How to Measure it’. Semiconductor International. № 10. pp. 54-58.
Ayvazyan, G. E. (1999). ‘Anisotropic Warpage of Wafers with Anodized Porous Silicon Layers. Phys.
Stat. Sol. (a). Vol. 175. pp.7-83.
Sergeev, V. S., Kuznetsov, O. A. (1994). Stresses and deformations in IC elements. Moscow: Radio
and Communication.
Yuzeich, B. M. (2003). Mechanical stresses in thin copper films on the monocristal Si. Metal physics
and new technologies. Vol. 25, № 6. pp. 747-761.
Serdega, B. K. (2011). Modulation polarimetry. Кyiv: Naukova Dumka.
Davydov, S. Yu. and Tikhonov, S. K. (1997). Photoelasticity and quadratic permittivity of wide-gap
semiconductors. Semiconductors. Vol. 31, № 7. pp. 698-699.