EFFECT OF PLASMA SURFACE TREATMENT OF POLYMERIC SUBSTRATES ON THE ADHESION OF JET-PRINTED SILVER NANOPARTICLE LAYERS
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Abstract
The effect of plasma surface treatment of polymer films on adhesion of jet printed silver nanoparticles layers was studied. The measurements were carried out by using of tensile testing machine. After plasma treatment an increase by 75% in adhesion was measured on the polyethylene terephthalate substrate, while the values on polyimide remain at the same level.
Ref. 23, fig. 7.
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References
J. Kawahara, P. A. Ersman, D. Nilsson, “Flexible active matrix addressed displays manufactured by printing and coating techniques,” J Polym Sci Part B: Polym Phys, 4, pp. 265−271, 2013. DOI: 10.1016/j.orgel.2013.10.008.
J. Chen, F. Xu, J. Wu, K. Qasim, “Flexible photovoltaic cells based on a graphene–CdSe quantum dot nanocomposite,” Nanoscale, 4, pp. 441−443, 2012. DOI: 10.1039/c2nr11656a.
A. M. Gaikwad, D. A. Steingart, T. N. Ng, D. E. Schwartz, G. L. Whiting, “A flexible high potential printed battery for powering printed electronics,” Appl. Phys. Lett. 102, 233302, 2013. DOI: 10.1063/1.4810974.
O. Kravchuk, M. Reichenberger, “Properties and long-term behavior of nanoparticle based inkjet printed strain gauges,” Journal of Materials Science: Materials in Electronics, 27, 10, pp. 10934−10940, 2016. DOI: 10.1007/s10854-016-5207-9.
B. J. DeGans, P. C. Duineveld, U. S. Schubert, “Inkjet printing of polymers: state of the art and future developments,” Advanced materials, 16(3), pp. 203−213, 2004. DOI: 10.1002/adma.200300385.
S. Logothetidis, “Flexible organic electronic devices: Materials, process and applications,” Materials Science and Engineering: B. 152(1): pp. 96−104, 2008. DOI: 10.1016/j.mseb.2008.06.009.
J. Perelaer, P. J. Smith, D. Mager, D. Soltman, S. K. Volkman, V. Subramanian, “Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials,” J. Mater. Chem. 20 (39), pp. 8446−8453, 2010. DOI: 10.1039/C0JM00264J.
S. M. Bidoki, D. M. Lewis, M. Clark, A. Vakorov, P. A. Millner, D. McGorman, “Ink-jet fabrication of electronic components,” Journal of Micromechanics and Microengineering, 17(5), pp. 967−974, 2007. DOI: 10.1088/0960-1317/17/5/017.
S. Khan, L. Lorenzelli, R. S. Dahiya, “Bendable piezoresistive sensors by screen printing MWCNT/PDMS composites on flexible substrates,” Proc. of 10th Conference on Research in Microelectronics and Electronics (PRIME), 2014 DOI: 10.1109/PRIME.2014.6872702.
Z. Zhang, X. Zhang, Z. Xin, M. Deng, Y. Wen, Y. Song, “Synthesis of monodisperse silver nanoparticles for ink-jet printed flexible electronics,” Nanotechnology. 22(42):425601, 2011. DOI: 10.1088/0957-4484/22/42/425601.
D. Owens, R. Wendt, “Estimation of the Surface Free Energy of Polymers,” J. Appl.Polym. Sci., 13, pp. 1741−1747, 1969. DOI: 10.1002/app.1969.070130815
ISO 4624:2002. Paints and varnishes -Pull-off test for adhesion.
J. Goßmann, “Einfluss von Plasmabehandlungen auf die Haftfestigkeit vakuumtechnisch hergestellter Polymer-Metal-Verbunde,“ Friedrich-Alexander-Universität, Erlangen, 2008. URL: https://opus4.kobv.de/opus4-fau/files/940/JoernGrossmann_Dissertation.pdf
T. Castro, R. Reifenberger, E. Choi, “Size-dependent melting temperature of individual nanometer-sized metallic clusters,” Physical review B., vol. 42(13), p. 8548, 1990. DOI: 10.1103/PhysRevB.42.8548.
V. K. Semenchenko. Surface Phenomena in Metals and Alloys, Pergamon Press, Oxford, p. 137, 1962. URL: https://www.researchgate.net/publication/44465266_Surface_phenomena_in_metals_and_alloys_VK_Semenchenko.
V. N. Troitskii, A. Z. Rakhmatullina, V. I. Berestenko, S. V. Gurov, “Initial Sintering Temperature of Ultrafine Powders,” Soviet Powder Metallurgy and Metal Ceramics 22, pp. 12–14, 1983. DOI: 10.1007/BF00792502.
A. N. Solodovnyk, W. Li, F. Fei, Q. Chen, “Involving Low-Pressure Plasma for Surface Pre-Treatment and Post Print Sintering of Silver Tracks on Polymer Substrates,” Proc. of the international conference nanomaterials: applications and properties, vol. 1 no 4, pp. 265−271, 2012 URL: http://nbuv.gov.ua/UJRN/princon_2012_1_4_39.
E. Halonen, T. Viiru, K. Ostman, A. L. Cabezas, M. Mantysalo, “Oven sintering process optimization for inkjet-printed Ag nanoparticle ink,” IEEE Trans. Compon., Packag. Manuf. Technol., vol. 3 no. 2, pp. 350−356, 2013. DOI: 10.1109/TCPMT.2012.2226458.
Y. K. Huang, S. P. Chen, S. Chun-Hao, Y. C. Liao, “Fabrication of Copper Thin Film Patterns with Highly Adhesive Silver-Decorated Polydopamine Ink,” Sci. Adv. Mater., 7, p. 227, 2015. DOI: 10.1016/j.jcis.2016.05.051.
Z. Li, R. Zhang, K. S. Moon, Y. Liu, K. Hansen, T. Le, C. P. Wong, “Highly Conductive, Flexible, Polyurethane‐Based Adhesives for Flexible and Printed Electronics,” Advanced Functional Materials, 23 (11), pp. 1459−1465, 2012. DOI: 10.1186/1556-276X-8-147.
J. Lee, P. Lee, H. B. Lee, S. Hong, I. Lee, J. Yeo, S. S. Lee, T. S. Kim, D. Lee, “Room‐temperature nanosoldering of a very long metal nanowire network by conducting‐polymer‐assisted joining for a flexible touch‐panel application,” Advanced Functional Materials 23 (34), pp. 4171−4176, 2013. DOI: 10.1002/adfm.201203802.
A. Smolarek, T. Fałat, A. Mościcki, A. Kinart, J. Felba, R. Kosowski, “Adhesion phenomenon of electrically conductive paths printed by nanoinks to typical substrates” Proc. of 36th International Microelectronics and Packaging Conference IMAPS-CPMT, Kołobrzeg, Poland. pp. 26−29, 2012. URL: http://www.amepox-mc.com/get_file.php?id=42.
U. Caglar, K. Kaija, P. Mansikkamäki, “Analysis of mechanical performance of silver Inkjet-printed structures,” Proc. of 2nd, IEEE INEC, Tampere, pp. 851−856, 2008. DOI: 10.1109/INEC.2008.4585617.