Modeling of Multifunctional Thermoresistive Transduser Used Heat Exchange Technology

Main Article Content

Sergey M. Osinov
https://orcid.org/0000-0003-0104-8236
Viktor Fedorovich Zavorotnyi
https://orcid.org/0000-0002-2240-1724
Boris Ivanovych Lupyna
https://orcid.org/0000-0002-5266-308X
Olexandr Vasylovych Borisov
https://orcid.org/0000-0003-4553-3591

Abstract

The physical and technical characteristics, structural and topological aspects of the micromechanical thermo-resistor active heating transdusers synthesis for fluid (gas and liquid) parameters determination are considered. All transducers are based on a single MEMS (Micro Electro Mechanical System) structure and differ in functionality due to different operating modes and different principles for determining fluid parameters. It allows the development of multifunctional sensors based on a single hardware, which includes a typical MEMS structure and mass production microprocessor, for example, PSoC (Programmable System On Chip). The transducers mathematical models acceptable for the COMSOL simulation library and designing of information electronics devices with the registration of various physical parameters are proposed. The analytical calculations on the basis of the proposed models for a gas flow sensor of the temperature dependence from the fluid flow velocity in the MEMS structure was performed. The proposed models can be used for the operation analytical description and computing of devices based on the use of thermoelectric processes in micro-scale structures.

Ref. 29, fig. 3.

Article Details

How to Cite
[1]
S. M. Osinov, V. F. Zavorotnyi, B. I. Lupyna, and O. V. Borisov, “Modeling of Multifunctional Thermoresistive Transduser Used Heat Exchange Technology”, Мікросист., Електрон. та Акуст., vol. 24, no. 2, pp. 33–41, Apr. 2019.
Section
Microsystems and Physical Electronics
Author Biographies

Sergey M. Osinov, National technical university of Ukraine "Igor Sikorsky Kyiv polytechnic institute"

microelectronic department

Viktor Fedorovich Zavorotnyi, National technical university of Ukraine "Igor Sikorsky Kyiv polytechnic institute"

microelectronic department

assoc.prof.

Boris Ivanovych Lupyna, National technical university of Ukraine "Igor Sikorsky Kyiv polytechnic institute"

microelectronic department

Olexandr Vasylovych Borisov, National technical university of Ukraine "Igor Sikorsky Kyiv polytechnic institute"

microelectronic department

prof.

References

N. Damean and P. P. L. Regtien, “Measurement concepts: From classical transducers to new MEMS,” Meas. J. Int. Meas. Confed., vol. 27, no. 3, pp. 159–178, 2000, DOI: 10.1016/S0263-2241(99)00057-3.

Girnyak Y., “Microelectronic Mechanical Systems In Modern Equipment,” Meas. Equip. Metrol., no. 69, pp. 97–102, 2008.

V.M. Tesliuk, Models and Information Technologies for the Synthesis of Microelectromechanical Systems. Lviv: Tower and Co, 2008.

M. Hautefeuille, B. O’Flynn, F. H. Peters, and C. O’Mahony, “Development of a microelectromechanical system (MEMS)-Based multisensor platform for environmental monitoring,” Micromachines, vol. 2, no. 4, pp. 410–430, 2011, DOI: 10.3390/mi2040410 .

S. Seok, Handbook of Mems for Wireless and Mobile Applications. Woodhead Publishing Limited, 2013, ISBN: 9780857092717.

I.Sh. Nevlyudov, V.V. Evseev, V.O. Bortnikova, Ya.O. Zamirets, “Analysis of modern means of automated design of microelectromechanical systems,” Technol. Adm., no. 1, pp. 3–8, 2014.

N. Damean, P. P. L. Regtien, and M. Elwenspoek, “Heat transfer in a MEMS for microfluidics,” Sensors Actuators A Phys., vol. 105, no. 2, pp. 137–149, Jul. 2003, DOI: 10.1016/S0924-4247(03)00100-6.

G. Kozlov, D. Randjelovich, Z. Djurić, “Analytical Modeling of Transient Processes in Thermal Microsensors,” in 12th. Int. Conf. Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE, 2011, pp. 1 – 7.

Feuchter M., "Investigations on Joule heating applications by multiphysical continuum simulations in nanoscale systems", PhD Disser. Karlsruher Institut fur Technologie (KIT), 2014, ISBN: 978-3-7315-0261-6.

A.G. Kozlov, “Error and adequacy of analytical modeling of temperature distribution in thermal microsystems,” in Problems of the development of promising micro and nanoelectronic systems 2014, Collected., 2014, pp. 167–172.

T. S. J. Lammerink, N. R. Tas, G. J. M. Krijnen, and M. Elwenspoek, “A new class of thermal flow sensors using ΔT=0 as a control signal,” in Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308), pp. 525–530, DOI: 10.1109/MEMSYS.2000.838572.

K. Kliche, S. Billat, F. Hedrich, C. Ziegler, and R. Zengerle, “Sensor for gas analysis based on thermal conductivity, specific heat capacity and thermal diffusivity,” in 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, 2011, pp. 1189–1192, DOI: 10.1109/MEMSYS.2011.5734644.

B. Zheng, C. Zhou, Q. Wang, Y. Chen, and W. Xue, “Deposition of Low Stress Silicon Nitride Thin Film and Its Application in Surface Micromachining Device Structures,” Adv. Mater. Sci. Eng., vol. 2013, pp. 1–4, 2013, DOI: 10.1155/2013/835942.

Lupyna B.I., “Micromechanical surface thermo-resistor transducer of linear fluid velocity in a rectangular cross-section channel,” Electron. Commun., vol. 21, no. 3(92), pp. 17–28, 2016. DOI: 10.20535/2312-1807.2016.21.3.81454

Patent of Ukrane No 76885 “A method for manufacturing a matrix of thermoresistive converters,” 2, 2013.

N. T. Nguyen and W. Dötzel, “Asymmetrical locations of heaters and sensors relative to each other using heater arrays: a novel method for designing multi-range electrocaloric mass-flow sensors,” Sensors Actuators A Phys., vol. 62, no. 1–3, pp. 506–512, Jul. 1997, DOI: 10.1016/S0924-4247(97)01529-X.

A. Talic, S. Cerimovic, R. Beigelbeck, F. Kohl, T. Sauter, and F. Keplinger, “MEMS Flow Sensors Based on Self-Heated aGe-Thermistors in a Wheatstone Bridge,” Sensors, vol. 15, no. 5, pp. 10004–10025, Apr. 2015, DOI: 10.3390/s150510004.

J. W. Van Honschoten, G. J. M. Krijnen, V. B. Svetovoy, H. E. De Bree, and M. C. Elwenspoek, “Analytic model of a two-wire thermal sensor for flow and sound measurements,” J. Micromechanics Microengineering, vol. 14, no. 11, pp. 1468–1477, 2004, DOI: 10.1088/0960-1317/14/11/006.

G. A. Frolov, O. M. Grudin, I. I. Katsan, B. I. Lupina. “Micromechanical gas heat capasity sensor,” in ESSDERS 96, 26th European Solid State Device Research Conference, 1996, pp. 215–218.

O. M. Grudin, G. A. Frolov, I. I. Katsan, and B. I. Lupina, “Thermal microsensor with a.c. Heating for gas-pressure measurements,” Sensors Actuators, A Phys., vol. 62, no. 1–3, pp. 571–575, 1997, DOI: 10.1016/S0924-4247(97)01571-9.

V.F. Zavorotny, O.V. Borisov, B.I.Lupina, S.M.Osinov. Patent of Ukraine No 18749 “Method of determination of gas density,” 2006.

F. Mailly, H. B. Nguyen, L. Latorre, and P. Nouet, “CMOS implementation of a 3-axis thermal convective accelerometer,” Proc. IEEE Sensors, vol. 2014-December, no. December, pp. 1471–1474, 2014, DOI: 10.1109/ICSENS.2014.6985292.

J. Bahari, R. Feng, and A. M. Leung, “Robust MEMS Gyroscope Based on Thermal Principles,” J. Microelectromechanical Syst., vol. 23, no. 1, pp. 100–116, Feb. 2014, DOI: 10.1109/JMEMS.2013.2262584.

S. Liu and R. Zhu, “Micromachined Fluid Inertial Sensors,” Sensors, vol. 17, no. 2, p. 367, Feb. 2017, DOI: 10.3390/s17020367.

I. Sh. Nevlyudov, V. Bortnikova. “Methods of automated design of manufacturing processes of MEMS accelerometers,” Technol. Approv. Dev., no. 1, pp. 8–10, 2018.

D. Yntema, “An integrated three-dimensional sound-intensity probe. Ph.D. Thesis,” University of Twente, Enschede, The Netherlands, 2008.

O. Pjetri, “Two - Dimentional Acoustic Particle Velocity Sensors Based on a Crossing Wires Topology, PhD Thesis,” University of Twente, Enschede, The Netherlands, 2016.

Sivukhin D.V., The general course of physics. Thermodynamics and molecular physics. Moscow: Nauka, 1979.

O.V.Borisov, I.S.Deineca, B.I.Lupyna. “Measurement of dynamic parameters of micromechanical thermistor converter using NI Elvis II software and hardware,” Electron. Commun., no. 5 (64), pp. 5–12, 2011.